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HP HP3-X11 Exam Syllabus Topics:
| Section | Weight | Objectives |
|---|---|---|
| Topic 1: Troubleshooting Methodology | 25% | - Operating system and software issues - Error codes and indicators interpretation - Systematic fault isolation - Diagnostic software and utilities |
| Topic 2: HP Notebook Product Overview & Specifications | 20% | - Hardware architecture and components - Product families and models - BIOS/UEFI and system configuration |
| Topic 3: Safety Procedures & Service Tools | 15% | - Safety guidelines and compliance - Electrostatic discharge (ESD) protection - Required service tools and equipment |
| Topic 4: Component Replacement & Repair Procedures | 30% | - Disassembly and reassembly guidelines - Storage, battery, and power system repair - Display, keyboard, and touchpad service - Network and peripheral component service - Motherboard, processor, and memory replacement |
| Topic 5: Post-Service Verification & Documentation | 10% | - Firmware updates and system calibration - Functional testing after repair - Service documentation and reporting |
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